New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Advanced Automated Optical Inspection equipment utilizing �Line Sensor Scanning� not the common strobe/camera technology. BF Series inline system offers post paste, bond, place and reflow inspection. The �Hero� off-line bench top model is also avai
Electronics Forum | Mon Apr 17 04:25:38 EDT 2006 | TA
Hi , Does any one has eperience on SAKI's ( Japan ) AOI m/c. They use Line Scan technology and claim to have the fastest. regards
Electronics Forum | Thu Jan 18 05:35:22 EST 2007 | joseluis_amper
Dear friends, I'm from Spain and, in this moment, we try to decide what AOI we need. We had in floor, in Demo, the SAKI, and it was good. But we want to test more machines, and I heard about Omron, Modus, Mirtec.....We have a litle production but so
Used SMT Equipment | AOI / Automated Optical Inspection
Include side Camera system Saki 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection High Inspection Quality, Accuracy This latest automated inspection solution from Saki contributes to enhanced qual
Used SMT Equipment | AOI / Automated Optical Inspection
BF-10D Made by Saki Corporation Japan Inspection Speed : 10 Sec / 250 x 330 mm Inspection Board Size : Single Lane : 460 x 330 mm Dual Lane : 250 x 330 mm BF 10D Dual Liane In-line High Resolution and High Speed AOI In-line 2D AOIScanning time for
Industry News | 2018-12-11 19:12:27.0
Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.
Industry News | 2016-03-16 21:07:50.0
SAKI is a leading company in the field of inspection solutions towards SMT(surface mount technology) lines. With SAKI’s innovative mind from its establishment, SAKI has built up a wide range of portfolio from solder paste inspection(SPI), 2D and 3D automated optical inspection(AOI), to 3D automated X-ray inspection(AXI) systems, aiming to realize high productivity solution for all customers.
P50BA2003BCS4D 25W N510043456AA AC Servo MotorDC24V 2.7A NPM H2 head MTNM000173AA KXF0DKAAA00 SPRING CM402 HOLDER 77 N210017657AB HOLDER DT401 HOLDER 78 N210007284AB CLAMP ARM CM602 HOLDER N210098763AB 79 N210068065AA SPRING CM602-holder
Parts & Supplies | Pick and Place/Feeders
Extension, a company established in 2009 and specialized in SMT industry for 15 years, sold over 200 lines to Europe,South America,Asia, helped thousands of factories build up their SMT line.And we have maintained long-term partnerships with renowned
Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
Career Center | Parañaque, Philippines | Maintenance
JOB DESCRIPTION Preventive Maintenance Execution of Preventive Maintenance activities, using the following frame work: Machine Cleaning, Inspection, Lubrication, Repair, Replace and Calibration. PM Documentation PM Master schedule PM Checklist Wo
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
| https://www.smtfactory.com/Flexible-LED-Lighting-SMT-Production-Line-In-Paragon-LED-In-Vietnam-id3085358.html
Flexible LED Lighting SMT Production Line In Paragon LED In Vietnam - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
Blackfox Training Institute, LLC | https://www.blackfox.com/everything-you-need-to-know-about-esd-management/
. As more devices today and in the future get more ESD sensitive, ESD management will be even more crucial. This article will look at all the things you need to know about ESD management and how you can effectively implement it by utilizing an electronic manufacturing industry consultancy service
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