Our Global Sales Manager Dirk Schade introduces the Condor Sigma Lite at SMT/Hybrid/Packaging 2013 in Nürnberg, Germany. A bond tester that can grow with your company. Put it to the test! For more information, go to www.xyztec.com https://www.xyztec
Industry News | 2016-01-25 10:53:14.0
Seika Machinery is pleased to introduce the MALCOM PCU-02V Spiral Viscometer. PCU-02V is designed for expensive material testing and analysis by obtaining the viscosity characteristics with only a 0.2cc sample.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2016-12-12 05:28:06.0
The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book online
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2021-05-21 14:09:53.0
Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
