Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Fri Jul 23 09:12:34 EDT 2004 | davef
We have run not AgPd [that we know of]. We can comment on PdNi. [But you're probably have Ni under the AgPd] In general, palladium solution rate is much slower than other sacrificial finish materials that we use for the purpose. The key then is to
Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve
I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob
Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are
Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Wed Feb 19 22:04:08 EST 2003 | davef
Blondie I've never heard of using palladium [Pd] for a ring. [Not that that means much.] See, here's a link to discussion on using Pd in jewlery: http://jewelry.about.com/gi/dynamic/offsite.htm?site=http%3A%2F%2Fwww.professionaljeweler.com%2Farchi
Electronics Forum | Thu Sep 02 10:24:35 EDT 2004 | dj_jago
Greetings from the UK: I have been quite fortunate to lead (no pun intended) our company towards lead free sooner rater than later. One of our customers produces a product which is refurbushed every 6 months or so and sent back into the market. A
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
