Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
ZESTRON proudly offers SIR testing at our Manassas, VA location. SIR is a quantitative test method used to characterize the PCB manufacturing process residues and their impact on reliability. ZESTRON’s SIR testing capability is offered to clients who
Electronic Circuit reliability testing system based upon extended SIR methods
The W. M. Hague Company distributes interconnect test systems for bare board test and semiconductor substrate test. In addition the W. M. Hague Co. distributes conformal coating systems (both dip and spray), SIR test systems and Warpage testers.
New Equipment | Test Equipment
Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards. Includes elements of ANSI/IPC-JSTD001C (as
Technical Library | 2014-02-06 17:49:48.0
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.
As the leader in precision cleaning, ZESTRON is uniquely positioned to offer you the analytical services and expertise needed to ensure you meet your precision cleaning requirements. Ionic contamination testing, SIR testing, ion chromatography, FTIR
Industry Directory | Consultant / Service Provider / Manufacturer
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field.
Industry News | 2024-03-18 12:59:34.0
Magnalytix will exhibit at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. The company will promote its capabilities as the industry's largest provider of third-party SIR testing services and comprehensive reporting of Objective Evidence at Booth #2811.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
