Industry News | 2014-01-07 18:34:43.0
Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
New Equipment | Solder Materials
DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
New Equipment | Solder Materials
Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S
Industry News | 2007-11-30 00:12:31.0
OSAKA, JAPAN � November 29, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces the opening of the Nihon Superior USA, LLC office at 3101 Cowley Way, Unit 176 in San Diego, CA 92117.
Industry News | 2008-02-11 15:49:48.0
GREELEY, CO � February 8, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, announces the NC162 SN100C� No-Clean Flux.
Industry News | 2008-02-28 14:06:10.0
GREELEY, CO � February, 2008 � FCT Solder, a division of FCT Assembly, announces that it will exhibit SN100C� Lead-Free products paste in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2008-03-05 22:38:31.0
OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.
Industry News | 2008-03-12 16:35:20.0
GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.
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