Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
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With the July2006 ROHS deadline approaching SigmaPrint Technologies are now able to supply colour coded �green� Squeegee assemblies. Colour coded squeegees are of great help to customers who are exempt from the directive, helping to ensure that the
New Equipment | Selective Soldering
Categories Selective Soldering machine Album View larger image Brand SAMTRONIK Model System-M Dimension（L×W×H) 950 x 1776 x 1565/1700 x 1776 x 1565 (mm) Conveyor height 900&pl
Technical Library | 2014-01-30 18:08:04.0
As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...
New Equipment | Selective Soldering
Categories Selective Soldering machine Album View larger image Brand SAMTRONIK Model System-C Dimension（L×W×H) 2700x1735x1415 (mm) Conveyor height 900±
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
New Equipment | Rework & Repair Equipment
Product Details DH-A2 BGA Rework Station 1.Application Of DH-A2 BGA Rework Station Suitable for different PCB. The motherboard of a computer, smartphone, laptop, MacBook logic board, digital camera, air conditioner, TV and other electronic equi
Industry News | 2016-08-03 20:06:03.0
Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
