Parts & Supplies | Semiconductor & Solar
Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Parts & Supplies | Semiconductor & Solar
Folder side (1016014-04) of MOMENTUM 125 Name :1016014-04 folder side, MPM MOMENTUM; 125 Part Number :1016014-04; Clamper; 2.0mm Description :1016014-04 folder side, MPM MOMENTUM; 125 Applicable models: MOMENTUM; 125 1016014-04 fol
Used SMT Equipment | Semiconductor & Solar
Yamaha YS24 SMT mahcine Model YS24: (Note: high-speed machine) Object substrate: L50 x W50mm to L700 x W460mm Mount capacity: 72,000CPH (0.05s /CHIP: our best condition) Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ)
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Y100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction
Used SMT Equipment | Semiconductor & Solar
Model YV100II SMT speed :0.25 SEC /CHIP high speed mount Substrate size: L600*W400(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 Mounting accuracy ± 0.1mm/CHIP ±0.08/QFP Power three-phase AC220/208/230/240/380/400/416 v + / - 10%,
Used SMT Equipment | Semiconductor & Solar
Product number: YS24 Products in detail Features: 72000 CPH (0.05 SEC/CHIP) abilityoutstanding pasted on the new development of double period of delivery 34 KCPH / ㎡ area of the world'sbest productivity L700x W460mm corresponding to ver