Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2019-09-26 12:16:40.0
Saki Corporation will present its 2D and 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems at Productronica India 2019. Productronica India is being held September 25-27 at the India Expo Center, Noida, Delhi, India. Saki technical experts will be available at the following booths: PCI booth PA11, iNETest booth PC11, and Prosem booth PE45.
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2019-01-05 16:56:23.0
Metcal today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate its Connection Validation (CV) Robotic Soldering System, CV Soldering System with new hand-pieces, CV-500 Soldering System and VFX-1000H Volume Fume Extraction System in Booth #1314.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
Industry News | 2013-03-25 14:54:55.0
Aqueous Technologies, will present a cleaning and reliability workshop to address emerging trends in electronic assembly that have a significant impact on precision cleaning.
Industry News | 2007-02-14 12:30:05.0
Smart Sonic introduces 440-R SMT Detergent in Ready-to-use Spray Bottles
Industry News | 2011-09-19 13:33:11.0
Viscom AG is now working with SILGAL IBERICA S.L. as its new representative for the entire Iberian peninsula. SILGAL will represent Viscom throughout Spain and Portugal.
