Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple
Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too
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RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
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Global economic growth is picking up, but the continuing economic crisis in the 17-nation euro area is delaying a meaningful recovery.
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Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
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