Electronics Forum | Wed Oct 15 17:40:42 EDT 2008 | bandjwet
Dear SMTNetters: What are some favorite techniques for getting all of the solder from a plated throughhole on a heavy ground plane area? We are using a SAC 405 alloy. Regards BWET
Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef
A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Tue Jan 28 16:27:43 EST 2003 | MikeF
I agree with most of the other suggestions here, but 90 C for a topside preheat temp seems low to me. I remember aiming for 98 to 104 C for topside temp just before hitting the solder. Boards that had large ground/power planes or a lot of layers I wo
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
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