Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef
Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her
Electronics Forum | Wed Oct 28 17:05:24 EST 1998 | Dave F
| Has anyone found a way to control viscosity of no-clean paste? | Mike: Mix it well and use the stuff before viscosity becomes an issue. Dave F
Electronics Forum | Tue Oct 27 09:05:29 EST 1998 | Mike Scott
Has anyone found a way to control viscosity of no-clean paste?
Electronics Forum | Mon Jun 27 09:35:24 EDT 2005 | russ
What is the viscosity of your lead free paste vs. your lead paste?
Electronics Forum | Thu Mar 04 07:35:38 EST 2010 | rajeshwara
Plz tell me Stencil Thickness ? Solder Paste ? Mesh Size ? Partcle size/type? Viscosity?
Electronics Forum | Wed Feb 15 10:59:58 EST 2023 | wippsen
the viscosity of the paste is too high, printing parameter is not the problem. did you use old solder?
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Wed Feb 23 00:45:49 EST 2011 | tsvetan
Does someone with technical knowledge knows what exactly happend with the solder paste after the shelf life pass? What we have seen is sometimes flux separation which disapear after a good mix, and change of viscosity i.e. drying. The tin, silver and
Electronics Forum | Fri Jan 21 11:00:56 EST 2011 | xps
Hi, in my experience, the humidity is trapped in the solder paste. Otherwise you can also try to : adjust preheat profile, and /or increase paste viscosity, and /or increase paste metal content (they are the most common causes).
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
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