Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 220V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed control, Cool Pipe
Used SMT Equipment | Soldering - Reflow
12 Heat Zones Voltage: 400V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, CBS, CE, Gen 5.1
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, External Cool
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane (MFFM), Fan Speed Control, CBS, Reactor, Cool Pipe
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
winsouce.jpg)
.gif)