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X3 Inline X-ray inspection system for 3D & Transmission.

X3 Inline X-ray inspection system for 3D & Transmission.

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The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo

MatriX Technologies GmbH

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason

In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t

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