4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
New Equipment | Cleaning Equipment
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
Custom libraries for automated aperture modifications Special cutting routines One-click data matrix code or barcode generation for stencil marking Fast Setup: Loose Foils and Framed Stencils The LPKF StencilLaser G 6080 automatically ad
Industry News | 2008-02-28 13:52:30.0
COLORADO SPRINGS, CO � February 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2014-08-28 11:13:11.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.
Industry News | 2020-12-01 02:49:29.0
Seika Machinery, Inc. announces its year-end sale on select products. Significant savings are available for McDry cabinets, Sawa portable handy cleaners and Sayaka PCB routers while stock lasts.
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
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