Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
New Equipment | Cleaning Agents
Heavy Duty Degreaser (HDD) GlobalTech® Heavy Duty Degreaser (HDD) is an aqueous cleaner that is more than 90% water based with all ingredients being 100% active. It has been specially formulated to remove all types of grease, oil, grime, and dirt f
The Polyonics polyimide tapes combine the unique electrical, thermal, chemical and mechanical properties found in polyimide with Polyonics proven coating, adhesive and manufacturing technologies. The tapes maintain these excellent properties over a w
New Equipment | Board Handling - Storage
Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat
The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
The Static Problem Electrostatic charging generates a significant amount of unwanted and potentially damaging electromagnetic interference (EMI) through both triboelectric and inductive charging. The charging occurs primarily in and around electron
Technical Library | 2014-07-31 16:36:59.0
Metal whiskers often grow across leads of electric equipment and electronic package causing current leakage or short circuits and raising significant reliability issues. The nature of metal whiskers remains a mystery after several decades of research. Here, the existence of metal whiskers is attributed to the energy gain due to electrostatic polarization of metal filaments in the electric field. The field is induced by surface imperfections: contaminations, oxide states, grain boundaries, etc. A proposed theory provides closed form expressions and quantitative estimates for the whisker nucleation and growth rates, explains the range of whisker parameters and effects of external biasing, and predicts statistical distribution of their lengths.
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
Industry News | 2018-05-30 16:32:42.0
ACL introduces two new lint-free wipe materials for critical cleaning to its Contamination Control line for applications which require pristine surfaces and extrinsic contamination removal.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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