New Equipment | Coating Materials
Conformal coatings for printed circuit boards cure tack free in seconds upon exposure to UV/Visible eliminating the time-consuming steps of traditional thermal-cure and room-temperature-cure conformal coatings. Coatings are available for tin whisker
Industry News | 2021-10-07 15:45:29.0
MacDermid Alpha Electronics Solutions announces the release of ALPHA WS-826 water soluble solder paste, designed to provide excellent environmental stability even in extreme operating conditions.
Industry News | 2010-04-11 03:15:20.0
The Balver Zinn Group announces that Cobar Europe BV has been awarded an NPI Award in the category of Soldering Materials for its Aquasol Branded Water Soluble solder paste. The award was presented to the Stan Renals, CEO of the Cobar Division during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2011-06-07 14:08:36.0
Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from tin/lead to lead-free SN100C-XF3+ solder paste and wire, and new high-performance fluxes at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Industry News | 2011-07-13 15:26:19.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.
Industry News | 2011-08-22 20:06:30.0
Cobar Solder Products will exhibit its lead-free SN100C-XF3+ solder paste and wire in Booth #407 at the upcoming IPC Midwest Conference & Exhibition
Industry News | 2012-06-01 09:27:11.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2015-09-29 22:17:04.0
Indium Corporation's Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Industry News | 2023-11-20 15:34:41.0
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
