Electronics Forum | Thu Feb 21 12:04:32 EST 2008 | pms
That is a correct assumption Doug.
Electronics Forum | Thu Feb 21 13:12:31 EST 2008 | dphilbrick
Just have your board house take them out of the mask layer.
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Wed Feb 20 18:05:24 EST 2008 | slthomas
Tented vias have solved problems for me in the past, but never created any. I have heard seemingly pointless discussions about whether or not the EE that designed the board designed it with filled vias in mind (a consideration of current carrying c
Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek
Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always
Electronics Forum | Thu Oct 28 15:53:27 EDT 2010 | dwonch
Ok, just to put closure on things I figured I should post the conclusion of this whole ordeal. We've acquired a new BGA rework station that allows us to get away without tenting our vias under the BGAs. This allowed us to change our PCB spec to rem
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Sun Feb 05 09:49:11 EST 2006 | Cmiller
We have been using ENIG for 8 years as our primary board finish. We have not seen any issues with tenting the vias. We have used a number of suppliers. The ENIG from China does not seem to solder quite as well in general but only had black pad from o
