Electronics Forum | Thu Oct 11 21:31:59 EDT 2007 | petep
As a CM, how can you change the customer's base PC Board material to RoHS Compliant T-g spec's etc? Curious ...
Electronics Forum | Mon Nov 20 10:40:35 EST 2006 | SWAG
Thanks Mark and Dave. It sounds like our board design and problem areas are similar to yours, Mark. We talked with our customer about the grid pattern but I'm not sure where we are at with that. In reference to the Tg/Td thread, the material is a
Electronics Forum | Fri Nov 16 08:22:03 EST 2007 | ck_the_flip
For those of you who've completely switched to Pb-Free or who're running in a mixed environment, are you also buying or specifying the "RoHS PCBs" - the ones with * Greater Tg (glass transition temperature) * Thru-holes with limited drill hits and
Electronics Forum | Fri Oct 27 11:17:41 EDT 2006 | MFG CAVEMAN
Since I didn't see it mentioned - Are you specifying a laminate that is considered compatible with a RoHS process? I don't mean just a high Tg but a high Td (decomposition) and CTE material such as Isola 410, FR408 etc.
Electronics Forum | Mon Feb 06 10:12:30 EST 2006 | Yash Sutariya
Hi, I authored the presentation so I may be able to help you out with your Q's. 1. IPC is in draft stage for 4 new material specs. These are in the presentation. I would focus on IPC 4101/ 121 and /124. Match your current Tg requirement to the T
Electronics Forum | Thu Feb 02 09:16:57 EST 2006 | lyrtech
Hi, I have some questions about material used in PCB for RoHS compliancy. It seems to be fuzzy between may manufacturer. Here are my questions: 1) What is the recommended material for lead-free assembly? 2) What's the difference between FR4 High Tg
Electronics Forum | Wed Jul 11 14:48:25 EDT 2007 | rgduval
My boss just received some info through a design mailing list that he's on claiming that FR406 is not RoHS compliant based on the limited number of processing cycles at RoHS compliant temperatures. I would guess that this is related to the relativel
Electronics Forum | Tue Feb 13 14:33:16 EST 2007 | CK the Flip
So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly fail
Electronics Forum | Fri Nov 16 08:46:30 EST 2007 | jdengler
For very simple boards, 2 layers lightly populated with light thermal mass, we still use FR4. For most of our Pb-Free boards we use the higher Tg material with moisture-resistant packaging. We are a CM so we don't usually get to change many of the
Electronics Forum | Thu Apr 26 16:47:52 EDT 2007 | Cmiller
Is anyone using standard FR-4 material for ROHS? All I have ever seen to indicate the need to go to a high tg/td board is that the material may fail after repeted rework. I have a customer that is trying to use IS-410 and it is causing electrical pro