Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
The 7320 Epidermal Thermal Imaging Professional Series (ETI-P) camera system is a high resolution 320 X 240 uncooled focal plane array infrared camera package complete with specialized imaging analysis software. This radiometric camera package is b
280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Fri Jun 16 11:08:30 EDT 2000 | Travis Slaughter
Did you try preheating the board then hand solder? Those little heat shrink guns work great for this.
Used SMT Equipment | X-Ray Inspection
Glenbrook RTX-113HV X-Ray Inspection System Vintage: June 2001 Tube Hours: Approx 1000 Calibrated through 2014, used approx 3-5 hours since 2014 High Voltage X-Ray for better results 80kV GTI-5000 Image Processor Motorized X-Y Sony Therma
Used SMT Equipment | In-Circuit Testers
FLIR A320 High Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and temperature measurement
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-for-smd-components_topic1009.html
Thermal Relief for SMD components - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login Thermal Relief for SMD components
| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f
: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75