Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Thu Sep 15 03:07:15 EDT 2005 | LeeHoMa
hi All, I am new to this forum and got a technical problem as below. Please see if anybody can help to solve it: I am currently producing one PCB board with 2 side SMD parts and all AI component in 1 side. I try to have both side SMD part soldered(
Electronics Forum | Thu Oct 02 17:55:16 EDT 2008 | davef
~le sigh~ makes a good point about forcing bent leads into the solder, letting the solder cool, and releasing the force on the lead. On the other hand, reforming leads of components prior to assembly is dangerous, also, because the "bending of a lead
Electronics Forum | Mon Aug 29 22:48:09 EDT 2011 | davef
Rich Here's what Humiseal says: Thermal Properties The coating must be able to withstand localized thermal 'hot spots' generated by components. High temperatures can cause short-term changes in coating characteristics, such as softening and lowered e
Electronics Forum | Fri Jun 06 06:11:18 EDT 2014 | paulg
I have a large monoblock ceramic filter on a PTFE based pcb material. The filter has a metal casing soldered onto the ceramic filter. I am concerned that if the heating rate is to rapid, then thermal shock / differential expansion could cause the fil
Electronics Forum | Thu Jul 25 18:41:52 EDT 2019 | myke03o
Hi I have solved the issue. The component cracking are the big 1210, 0603 and 0402 capacitors. After studying and testing in many type of solder. The best to use is SnPb and the components are the key - there are component which will tend to expand
Electronics Forum | Sun Dec 10 20:17:51 EST 2017 | myke03o
Hi Dave, thanks for the response. * Improve your products that are used for thermal cycling testing of products of other companies? Yes we want to improve our products to pass thermal cycling and prolong the lifespan of the baord. * Change your pr
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
