When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Industry News | 2015-10-29 12:40:13.0
Whizz Systems has a brand new Seica S40 Pilot LX tester in-house. It is an extra-large flying probe system well-suited to test any type of electrical board.
Industry News | 2021-06-26 09:04:13.0
Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.
Industry News | 2019-03-03 19:17:17.0
Whizz Systems, Inc. is pleased to announce that it has improved operational technology and increased production by implementing an automated warehouse system supplied by Juki Automation Systems. The automated warehouse, consisting of eight ISM 2000 Fortresses and an ISM 500 Intelligent Storage System, replaces Whizz’s warehouse consisting of shelving and racks while reducing the amount of space required.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
