Electronics Forum | Tue Jun 10 01:09:37 EDT 2003 | iman
Hi! Thanks to you as the first replier! I do admit it "narrows" the information channels feedback flow by keeping this thread reply limited to "non-commercial" engineering folks, but I already have lotsa war stories from the salesmen around this reg
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Thu Aug 08 15:16:03 EDT 2002 | OhioD
A "Pumpprint" stencil refers to a thick DEK stencil with pockets routed-out on the underside, so it will clear any THT leads, paste/glue deposits, etc., and not squish them. It's called pummprint because it was developed to use the ProFlow-type head
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Mon Jun 26 08:57:17 EDT 2017 | capse
If N2 is not an option, the cut wire feeder or drilled wire are your best bet for now. You need to optimize wire feed rate as well. The solder joint on the robot takes about the same time to form as in manual soldering. If you need to speed the solde
Electronics Forum | Fri Jun 11 03:14:03 EDT 2010 | muarty
Thanks Dax, We currently employ a stencil aperture design pretty much similar to that you describe. And you are correct in what you say about the thermal demands almost dictating the allowable voiding level. We have suggested to our customer that th
Electronics Forum | Fri Feb 22 18:36:36 EST 2013 | austinpeterman
Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder pro
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Fri Nov 11 13:52:05 EST 2011 | SheanDalton
What is the size of the low standoff components you find trace wash effluent? and, what is the gap from the board to the underside of the component? If your component has a very low standoff, and/or, a wide footprint, you may want to consider findi
