Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Mon Mar 12 08:59:46 EDT 2007 | davef
Questions are: * You say 'voids', but you describe poor barrel fill. Are you seeing both? * Sometimes designers need to reduce the heatsink effect of large ground and power places, but this usually shows on the two upper corner pins, not all corners
Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker
I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
