Industry News | 2021-12-21 15:06:19.0
KIC will exhibit in booth 3009 and the Factory of the Future Pavilion at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022, at the San Diego Convention Center San Diego, CA. The KIC team are thermal process experts who make ovens smarter. Along with award-winning Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and their complete ecosystem of solutions for thermal processes.
Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Industry News | 2021-06-17 15:18:27.0
Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Industry News | 2018-02-26 11:10:21.0
Saki Corporation will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX Expo, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.
Industry News | 2012-01-17 16:27:31.0
Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Industry News | 2012-03-08 21:29:50.0
Nordson DAGE will highlight its new X-Plane™ technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.
Industry News | 2012-04-27 13:32:30.0
Nordson DAGE has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
Industry News | 2012-07-02 09:45:46.0
No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE
Industry News | 2012-10-17 11:19:43.0
Nordson DAGE announce that it has been awarded a 2012 Global Technology Award in the category of Software – Production for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
