Electronics Forum: voiding on led thermal pads (16)

Solder balls high on IC

Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl

Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Industry News: voiding on led thermal pads (16)

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

Industry News | 2018-04-09 19:51:33.0

SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

Technical Library: voiding on led thermal pads (2)

Influence of Plating Quality on Reliability of Microvias

Technical Library | 2016-05-12 16:29:40.0

Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.

CALCE Center for Advanced Life Cycle Engineering

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Technical Library | 2018-09-26 20:33:26.0

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

AIM Solder

Videos: voiding on led thermal pads (1)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: voiding on led thermal pads (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: voiding on led thermal pads (554)

SMTnet Express - December 16, 2017

SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd

SMTnet Express - September 27, 2018

SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom

Partner Websites: voiding on led thermal pads (188)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY Richard Coyle1, Dave Hillman2, Michael Barnes3, David Heller3, Charmaine Johnson1, Richard Popowich1

Heller Industries Inc.

Thermaltronics TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of

| https://pcbasupplies.com/tmt-5000s/

Thermaltronics TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of each solder Toggle menu Call Us


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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411