Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC
We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O
Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T
| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper
| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
Electronics Forum | Thu Nov 19 06:20:44 EST 1998 | Kelly
| For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder a
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
