Electronics Forum | Wed Jul 30 07:41:08 EDT 2014 | williamaxler
I have seen similar issues in the past. 1. We had an issue when the relays were installed a leg was bent over. This cracked the epoxy base and allowed water and flux to get in. 2. We have had to bake relays after washing. We would cut open the
Electronics Forum | Mon Feb 09 09:45:16 EST 2015 | saoasasd
Thanks for the support Jax. Our current scenario: Baking - Not allowed for PCBs Washing - Not allowed Heat Cycles - 2 (Bottom and top side). It's a notebook board Our concern is related to solderability because OSP finishing will be seriously imp
Electronics Forum | Tue Sep 05 11:18:54 EDT 2000 | Chris May
Pascal, Hopefully, the system that you invest in will have a programmable drying cycle as one of its features. As far as humidity content is concerned, I am sure that some more learned colleagues may be able to help you. Although, I believe some p
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Tue Mar 30 07:34:46 EST 2004 | TONY
We are running double side micro bga boards and we were told to run one side, wash them, put them in the oven at 125c for 1 hour and putting them in the dry cabinet until we run the other side. Is this necessary? It is time consuming for us to wait
Electronics Forum | Fri Aug 19 08:41:04 EDT 2005 | davef
If these are these bare [or partially assembled] boards, baking probably will not hurt, as long as the bake is not excessive. If these are these assembled boards, baking probably will not accomplish much. What is the source of this water? If it's
Electronics Forum | Thu Mar 03 12:57:10 EST 2022 | dontfeedphils
Probably need more info on the PCB and why baking before reflow processing is part of your process, but if you're baking before reflow it makes sense you'd bake before rework. Is there a reason you don't AOI before wash?
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
