Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sample Ma
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
Parts & Supplies | Pick and Place/Feeders
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
.jpg)
Used SMT Equipment | Screen Printers
DEK Horizon 02i SMT stencil printer Description DEK Horizon 02i SMT stencil printer is maximizing utilization by reducing stoppages and downtime to keep the printer productive. It is driving up throughput and yields to deliver more end-of-line outp
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Parts & Supplies | Visual Inspection
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
Parts & Supplies | Visual Inspection
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
