Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
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PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
The YXLON Cougar EVO series was designed to provide the "best-in-class" inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and
Industry News | 2011-09-26 16:59:34.0
Nordson DAGE announces that Dr. David Bernard, Product Manager – X-ray Systems, will present a paper titled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition.
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PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Why compromise? Choose a custom-built EVO solution for premium inspection. As technology advances at an ever increasing rate, YXLON has acknowledged that a “one size fits all” X-ray system in advanced electronics no longer delivers the best solution
STI is equipped with a state of the art 26,000 sq ft manufacturing area with the latest in high speed placement, inspection, and test equipment in addition to work cells to assemble complex box builds. Our personnel are uniquely qualified to assemble
Industry News | 2011-11-27 00:51:50.0
Nordson DAGE launched X-Plane™ at the Productronica show.
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Tropical Assemblies, Inc. is a 20 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. AS9100/ISO Certified, ITAR reg.
