Used SMT Equipment | SPI / Solder Paste Inspection
SPI PARMI SPI HS60L PARMI solder paste inspection machine SPI HS60 product introduction: 1. The SPI HS60 Series series is PARMI's best-selling model. It has been installed in excellent SMT production sites around the world. Its performance st
Parts & Supplies | Assembly Accessories
37. 5322 466 12047 peel-off plate 16mm PLATE STEEL 5322 360 40471 BDA-16x25,KONGANE1 CYLINDER PISTON 5322 132 00032 /Nozzle Station Fibre 5322 130 10062 /Nozzle Station Fibre 5322 130 10069 /SENSOR Conveyor in/out 1-3 5322 380 10285 /Multi-came
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Parts & Supplies | Pick and Place/Feeders
9498 396 00003 EMERGENCY SWITCH 9498 396 00091 Touch screen 9498 396 00006 Indicator green 9498 396 00007 Indicator white 9498 396 00008 Indicator blue 9498 396 00005 Buzzer 9498 396 00093 POWERS
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Parts & Supplies | Assembly Accessories
J67081003A SAMSUNG FILTER SMT Other Samsung parts: 1. SAMSUNG SM421 head filter J7458002A; 2. SAMSUNG SM471, 481, 482 head filter J67081017A; 3. SAMSUNG SM421, SM471, 481 oil-water filter J67081002A/J67081003A; 4. SAMSUNG SM431 oil water filter
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Parts & Supplies | Assembly Accessories
MPM UNDOWN DRIVER PC3406Ai-001-R .1009264 MPM 125 printer belt 1014951 MPM AP25/UP2000 Tactile Motor P26443-12-017 1002440 MPM LED 1014870/1014868 MPM Clean paper 350mm MPM350SCP-P MPM Clean paper 600mm MPM600SCP-P NPM CPK DUMMY
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Parts & Supplies | Pick and Place/Feeders
37. 5322 361 11113 peel-off plate 16mm PLATE STEEL 5322 466 12047 BDA-16x25,KONGANE1 CYLINDER PISTON 5322 360 40471 /Nozzle Station Fibre 5322 132 00032 /Nozzle Station Fibre 5322 130 10062 /SENSOR Conveyor in/out 1-3 5322 130 10069 /Multi-came
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Industry News | 2008-09-12 03:52:21.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
