New Equipment | Cleaning Equipment
Durable Construction The MicroJet in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding, rigid metal chassis, unibody construction, a detachable load section, and hinge
New Equipment | Cleaning Equipment
The HydroJet Washes with Chemistry or Water in One Machine! Durable Construction The HydroJet in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding, rigid metal chas
New Equipment | Cleaning Equipment
High Temperature, High Pressure Aqueous/Semi-Aqueous Batch Electronics Cleaning Systems Forget the limitations of the past and experience a batch system that offers multiple cleaning technologies for capability previously unachieved in a compact fo
New Equipment | Cleaning Equipment
Aqueous / Semi-Aqueous Inline PCB Cleaning Systems Durable Construction The HydroJet™ in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding rigid metal chassis, unib
New Equipment | Cleaning Equipment
Aqueous and Semi-Aqueous PCB Cleaning Systems The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today. Progressive Energy Dynamics (PED™) is a proprietary spray
New Equipment | Cleaning Equipment
Trident LDO Low Discharge Automatic Defluxing-Cleaning and Cleanliness Verification System Detailed Information HERE: www.aqueoustech.com Trident LDO Fully Automatic Cleaning and Cleaniness Verification System Removes Any Flux From Any
New Equipment | Cleaning Equipment
Trident ZDO Detailed information HERE: www.aqueoustech.com Zero Discharge Automatic Defluxing-Cleaning and Cleanliness Verification System CLEAN - VERIFY - RECYCLE Trident ZDO Zero Discharge Fully Automatic Cleaning System and Cleanliness Ver
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
