Bonding chip and Silicone dispensing on the PCB board
Our LCDs are manufactured using COG (Chip On Glass), COB (Chip On Board), TAB (Tape Array Bonding) and COF (Chip On Flex) technology. From small graphic units suitable for cell phones to character modules for industrial use to larger TFTs (Thin Film
New Equipment | Board Handling - Storage
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
New Equipment | Education/Training
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
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COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
