New Equipment | Cleaning Agents
440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R
Low Cost Misprint Cleaning and Stencil Cleaning Systems. Completely Air Driven for ease of use. Standard Misprint unit handles 12x18"PWB cost $1200.00. Stencil Clean System for 23x23" cost $10000 with Misprint option included. Manufacturers of Nitrog
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
Petroferm offers a complete line of aqueous, semi-aqueous, and manual solvent cleaning chemistries for removing raw solder paste and surface mount adhesives from stencils and misprinted boards both by hand and in stencil cleaning equipment. HYDREX A
Petroferm offers a complete line of cleaning chemistries for use in immersion ultrasonic cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards and production fixtures, as well
New Equipment | Solder Materials
Kapp Alumite fluxless Aluminum soldering & brazing rod for the fabrication, maintenance and repair of cast Aluminum and Zinc alloys. Alumite™ has been used and endorsed by leading cast Aluminum, diecast and white metal manufacturers for over 60 years
440-R SMT Detergent is the most widely used aqueous-based chemistry for cleaning SMT screens, stencils, misprinted PCBs, pallets, oven radiators and related tooling. It is the only cleaning chemistry to be verified by the U.S. Environmental Protecti
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long-term reliability expected in the har
