New SMT Equipment: copper filled thermal vias (Page 1 of 21)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

ELECTROVERT VectraES ™ - SMT Wave Soldering System

ELECTROVERT VectraES ™ - SMT Wave Soldering System

New Equipment | Wave Soldering

The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol

ITW EAE

ELECTROVERT Electra - SMT Wave Soldering System

ELECTROVERT Electra - SMT Wave Soldering System

New Equipment | Wave Soldering

The most advanced high-performance wave soldering system designed for high-volume manufacturing. Electra's proven performance has provided the electronics assembly industry with world-class soldering results. The Electra system is designed with

ITW EAE

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

ELECTROVERT VectraElite - SMT Wave Soldering System

ELECTROVERT VectraElite - SMT Wave Soldering System

New Equipment | Wave Soldering

The ELECTROVERT VectraElite is the wave soldering solution for medium to high volume production that requires fast changeover, process flexibility, and system reliability. The VectraElite combines innovative technology in an accessible platform provi

ITW EAE

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

Custom Components

Custom Components

New Equipment | Components

At Barry: custom requests are common and welcome. We enjoy the challange. Extensive capabilities, wide material selection and state-of-the-art equiptment (including in-house plating and machining) ensure we can deliver a component fitting your exact

Barry Industries, Inc.

Machvision 3D Profiler

Machvision 3D Profiler

New Equipment | Software

The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accu

Christopher Associates Inc.

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Other

IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou

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