Manufacturer：Panasonic Package：CAP ALUM 680UF 20% 50V RADIAL Date Code：19+ Description：Cap Aluminum Lytic 680uF 50V 20% (16 X 20mm) Radial 7.5mm 1835mA 5000h 105°C Automotive Bulk http://www.smdmarkingcodes.com/parts/details?id=EEUFC1H681
Manufacturer：Samwha Package：HG,330uF/400V, 25,4*40 Date Code：19+ Description：HG,330uF/400V, 25,4*40 http://www.smdmarkingcodes.com/parts/details?id=HG2G337M25040HA
Manufacturer：Vishay Package：CAP FILM 0.033UF 20% 1KVDC RAD Date Code：18+ Description：Cap Film Suppression X1 0.033uF 440VAC PP 20% (17.5 X 6 X 12mm) Radial Plastic Rectangular Can 15mm 105°C Loose http://www.smdmarkingcodes.com/parts/details?
Manufacturer：KEMET Package：MLCC 3300PF 2KV 10% 1210 Date Code：15+ Description：Cap Ceramic 0.0033uF 2000V X7R 10% SMD 1210 125°C Embossed Plastic T/R - Tape and Reel http://www.smdmarkingcodes.com/parts/details?id=C1210X332KGRAC7800
Manufacturer：Epcos Package：CAP FILM 2200PF 5% 1.6KVDC RAD Date Code：13+ Description：Cap Film 0.0022uF 1600V PP 5% (13 X 5 X 11mm) Radial 10mm 110°C Automotive Bulk http://www.smdmarkingcodes.com/parts/details?id=B32671L1222J
Manufacturer：Epcos Package：CAP FILM 0.1UF 10% 1KVDC RADIAL Date Code：11+ Description：Cap Film 0.1uF 1000V PP 10% (18 X 9 X 17.5mm) Radial Wound 15mm 110°C Automotive Bulk http://www.smdmarkingcodes.com/parts/details?id=B32652A104K
Manufacturer：AVX Package：MLCC 0805 50V X7R 0.01uF 10% Flexterm Date Code：13+ Description：Cap Ceramic 0.01uF 50V X7R 10% Pad SMD 0805 FlexiTerm 125°C T/R http://www.smdmarkingcodes.com/parts/details?id=08055C103KAZ2A
Manufacturer：Samwha Package：470uF/16V, 8*11,5,RD Date Code：13+ Description：Capacitor: electrolytic, THT, 470uF, 16VDC, Ø8x11.5mm, Pitch: 3.5mm http://www.smdmarkingcodes.com/parts/details?id=RD1C477M0811MBB180
Manufacturer：HEC Package：1206 680PF 1KV X7R ±10% Date Code：16+ Description：HEC 1206 680PF 1KV X7R ±10% http://www.smdmarkingcodes.com/parts/details?id=C1206X681K102TX
New Equipment | Cable & Wire Harness Equipment
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fi
