New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Stentech has advanced capabilities in machining and drilling composite materials. Stentech can provide a wide range of manufacturing solutions for wave solder pallets that are custom-engineered and manufactured to each client's specifications. The u
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Board Handling - Conveyors
S&M Automation Ltd is one of the biggest and most professional SMT machine manufacturer in China. Our products line includes Reflow Oven, Wave Soldering Machine, PCB Handling Conveyor, BGA Rework Station and etc. We have over 18 years of experience o
