New SMT Equipment: encapsulating (Page 5 of 32)

Conformal Coating & Potting

Conformal Coating & Potting

New Equipment | Other

A.I.F. Soldeertechniek BV is a Dutch company specialized in the protection of electronics against external influences. Due to the miniaturization of electronic components and the growing number of applications for  electronic control systems, the pr

A.I.F. Soldeertechniek BV

Glue Dispenser

Glue Dispenser

New Equipment | Dispensing

Glue Dispenser is using for encapsulation and protection of PCBA and FPC soft board parts, reinforcement of camera module, fingerprint recognition module dispensing IC chip, component underfill and component encapsulation shell frame dispensing,

Shenzhen HTGD Intelligent Equipment Co., Ltd.

BGA Assembly

BGA Assembly

New Equipment | Assembly Services

PCBMay Provides BGA assembly, SMT assembly and Turnkey PCB assembly services with extensive experience and knowledge. Ball Grid Array is an important type of surface-mount packaging employed in integrated circuit boards. Ball Grid

PCBmay

Electronic Assembly Materials

New Equipment |  

Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets

M&M Associates

Conductile

Conductile

New Equipment |  

VPI Solid Vinyl ESD control tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Conductile (static-conductive) vinyl tile contains encapsulated conductive elements of the carbon family that are

VPI, LLC

Statmate

Statmate

New Equipment |  

VPI ESD control vinyl tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Statmate (static-dissipative) vinyl tile contains encapsulated conductive elements of the carbon family that are distrib

VPI, LLC

High Purity Liquid Encapsulant: SMT 158HA

New Equipment | Materials

 YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA    (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularl

YINCAE Advanced Materials, LLC.

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

UV-3010 UV Curable Conformal Coating / Encapsulant

UV-3010 UV Curable Conformal Coating / Encapsulant

New Equipment | Materials

Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h

Conductive Compounds, Inc.

GPD High Precision Adhesive Dispensers - MAX Series

GPD High Precision Adhesive Dispensers - MAX Series

New Equipment | Dispensing

MAX Series High Precision Dispensers Available for Heated & Non-Heated Applications The MAX Series is the premier line of GPD Global high precision dispensers. This dispense equipment can process a wide variety of dispense applications: MicroVolu

Southwest Systems Technology


encapsulating searches for Companies, Equipment, Machines, Suppliers & Information

Sell Your Used SMT & Test Equipment

Easily dispense fine pitch components with ±25µm positioning accuracy.
Blackfox IPC Training & Certification

Benchtop Fluid Dispenser
Void Free Reflow Soldering

Software for SMT placement & AOI - Free Download.
pressure curing ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.