New SMT Equipment: fine pitch lazer soldering (Page 1 of 7)

SMT Stencils

SMT Stencils

New Equipment | Solder Paste Stencils

We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c

Metal Etch Services, Inc.

Stencils

New Equipment |  

Quality stencils for coarse and fine pitch solder and epoxy deposition. Cost and quality competitive against laser cut stencils. Twenty-four turn, no premium!

Hybrid Screen Technologies, Inc.

SMT Step Stencils

SMT Step Stencils

New Equipment | Solder Paste Stencils

Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste

Stentech

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

Design and Manufacturing with SMT Surface Mount Technology

New Equipment |  

The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat

Ray Prasad Consultancy Group

NS Flux-Cored Lead Solder

NS Flux-Cored Lead Solder

New Equipment | Solder Materials

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew

Nihon Superior Co., Ltd.

SI-P850 Solder Paste Printer

SI-P850 Solder Paste Printer

New Equipment | Printing

This high efficiency unit is capable of a wide range of consumer or industrial applications. High Performance and Cost Effective, Flexible Changeover and Capable of M/L size PWB's for Flexibility, Optional PCB support up to 27.6" X 16" or 20" X 18",

Sony Manufacturing Systems America, Inc

S3088 flex - High-speed AOI of Fine-pitch Components

S3088 flex - High-speed AOI of Fine-pitch Components

New Equipment | Inspection

Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib

Viscom AG

Electronic PCB assembly

New Equipment |  

Our manufacturing capabilities allow us to support all aspects of the electronics manufacturing process. Our production processes include: High speed continuous flow SMT lines. High Mix SMT and PTH. Automated PTH assembly. Fine Pitch, BGA, CSP, C

Apsco International

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