New SMT Equipment: foil tension method (Page 1 of 2)

VectorGuard - Frameless Stencil Tensioning System

VectorGuard - Frameless Stencil Tensioning System

New Equipment | Printing

VectorGuard is a patented frameless stencil tensioning system offering significant advantages over conventional stencil technologies. Taking all the benefits of frame-mounted stencil systems, VectorGuard improves upon them and delivers a solution cap

ASM Assembly Systems (DEK)

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Dicing Blades

Dicing Blades

New Equipment |  

Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to

Keteca USA

Laser Cut SMT Stencils

Laser Cut SMT Stencils

New Equipment | Solder Paste Stencils

Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”

Tropical Stencil

Surface Mount Stencils.

Surface Mount Stencils.

New Equipment | Solder Paste Stencils

Laser Cut Stencils: Industry trend toward miniaturization is leading to finer pitch requirements, high tolerances, and greater repeatability. Our state-of-the-art laser technology enables our customers to experience positional accuracy unattainable w

Great Lakes Engineering, Inc.

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

LPKF Flex Cutting and Depaneling Systems

LPKF Flex Cutting and Depaneling Systems

New Equipment | Depaneling

When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time

LPKF Laser & Electronics

SMT reflow oven R50CD with mesh belt and pin chain

SMT reflow oven R50CD with mesh belt and pin chain

New Equipment | Soldering Robots

Model  R50CD (Computer) Heating zones  Upper 5/lower 5 Length of heating zone 1730mm PCB width  Chain 300mm, mesh 350mm Conveyor chain width range  50-300mm PCB direction  L→R  or (R→L) Chain fixing Front fix(back fix is optional) Conveyor hei

Beijing Glichn S&T Development Co.,Ltd

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

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Selective Soldering Nozzles

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