New Equipment | Soldering Robots
Specification: welding machine 1. Accurate Tin press,not drag 2. Accurate heat 3. Fine-pitch position 4. Digital program pressure control Model CWPC-1A Working area (mm) 200*260
New Equipment | Soldering Robots
Feature: 1. Extremely short cycle time with rotary table design 2. Product loading and unloading can be done during the heat sealing process 3. High quality heat seal application up to 0.25mm pitch 4. Pneumatic bonding head provide up to 3,900N
Detailed Product Description: 1. For electronics, cell phones, computers, PCB, FPC (flexible printed circuit board) 2. Mold make of SKD-11 Steel,Blade is SKD-9(From Japan),Rigorous Job!!!! Technical characteristics: 1. Structural precision, t
10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z
New Equipment | Soldering Robots
Description: Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call hot bar reflow soldering sys
FPC Laser PCB Separator UV for Complex Contours Precision Cutting PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dici
New Equipment | Soldering Robots
Advanced Tech Pulse Heat Hot Bar Soldering Machine With Flexible Fixture CWPP-1S Specification: Data lines Link welding machine 1. Accurate Tin press,not drag 2. Accurate heat 3. Fine-pitch positioning 4. Precision Technology paramet
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Each high-density GeneChip array provides multiple, independent measurements for each transcript and genotyping call. Multiple probes mean that you get a complete data set with accurate, reliable, reproducible results from every experiment. For more
