Catalyst Semiconductor, Inc., a major worldwide EEPROM memory supplier,offers environmentally safe lead-free and halogen free packaged integrated circuits. Catalyst now offers lead-free and halogen-free package options for its popular SPI(TM), I2C(
Catalyst Semiconductor, Inc., a major worldwide EEPROM memory supplier,offers environmentally safe lead-free and halogen free packaged integrated circuits. Catalyst now offers lead-free and halogen-free package options for its popular SPI(TM), I2C(
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
The Polyonics polyester tapes offer effective, low cost materials for those applications involving lower temperatures and less harsh environments. The excellent electrical, thermal and mechanical properties of polyester combined with Polyonics proven
New Equipment | Solder Materials
Kester offers a complete line of solder paste to fit the needs of the electronic assembly market. The preferred products below cover the complete range of application types including No-Clean, Water Soluble, Halogen-Free and Lead-Free.
is a solvent-based cleaning medium, free of CFC, halogens and water, specially designed to remove acrylic and acrylurethane lacquers from PC boards and screens. Surfactant-free formulation of PROTON 71 eliminates the formation of white residues on c
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
