The BGA-100 Series consists of the BGA-100, BGA-200 and BGA-300 Inspection Tools. These tools allow high magnification viewing underneath BGA and other SMT packages. The compact, handheld systems are easy to carry through the factory or to differ
ERSA mobile scope - camera units with lenses and desk-top holder ERSA mobile scope - solder joint inspection in the twinkling of an eye The ERSA mobile scope is a compact and handy, portable video microscope to inspect solder joints in electronic
Semi Automatic Optical Inspection for SMT & THT Printed Circuit Board Assemblies Eliminate inaccurate and slow manual visual inspections for a fraction of the price of an AOI machine. The SimmScope SAOI is a powerful user-friendly bench top PCBA insp
This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope
90kV, 5 Micron Microfocus X-Ray Inspection System. Featuring wide inspection area with tilting X-Ray tube capability. Standard features of the X-Scope 1800 X-Ray Inspection System: 4′ x 3′ digital flat panel detector 90 kV- 5 micron x ray tube
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
90kV/110kV, 5 Micron Microfocus X-Rai Inspection System. The X-Scope 2000 series is a general purpose, high resolution, fully programmable x-ray system designed to address the nondestructive testing needs for failure analysis, research and developme
130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu
YSC Scope (Model YSC-70, YSC-130 and YSC-7014) with integrated LED lighting and camera are ideal for BGA, CSP and QFP inspection. Interchangeable 90 degree horizontal viewing prism tips from 0.5 mm to 2.0 mm size can be used for various stand off hei
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
