New Equipment | Fabrication Services
Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm
Simple, easily applied, and effective methods, materials and instrumentation will save you big and hidden expenses incurred to pay for production rejects and unexpected, post shipment guarantee repairs caused by Electrostatic Discharge. Professional
Whether temperature-sensitive plastics, metals, silicium disks, glass, foil or paper - for the first time - Reinhausen Plasma GmbH's patented plasmadustlll technology permits almost any material to be metallized and coated without solvents and with e
Stamp-Test's "Indicator Stamps" were developed with the RoHS directive in mind. Much smaller than a postage stamp, they can be placed on any surface to verify the presence of hazardous materials within seconds. The method is virtually a “Lab in a Sta
New Equipment | Board Handling - Storage
Flexible, Fully Automatic SMD Storage System. Cubus - the next-generation SMT storage device – innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully user configurable and
ELECTRONIC MANUFACTURING SERVICES (www.sun-tec.ch) ON TEMPERATURE SENSITIVE MATERIALS: SUN-TEC has developed its own cold curing, solvent free contact glues to be able to pick and place SMD systems on heat sensitive substrates. That is why SUN-TEC's
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V
New Equipment | Cleaning Equipment
smt stencil clean roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Most MPM pr
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