Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
Assembly of MCM's on laminate, flex, or ceramic
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
VSS vacuum soldering systems are available for the ultimate in semiconductor or MCM soldering. For any soldering requirement from vacuum, to nitrogen-inert to forming gas, the VSS provides complete control over the process environment.
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
1109 20GHz TDR Tester Product Classification: TDR Method Impedance Tester for High Speed, High Frequency Boards Product Description: The 1109 20GHz TDR Tester provides a test head equipped with dedicated high-frequency probes for TDR measurement w
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
