Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
Assembly of MCM's on laminate, flex, or ceramic
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
VSS vacuum soldering systems are available for the ultimate in semiconductor or MCM soldering. For any soldering requirement from vacuum, to nitrogen-inert to forming gas, the VSS provides complete control over the process environment.
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled
New Equipment | Industrial Automation
Programs > Rockwell Software > RSLogixEmulate 5000 > RSLogix Emulate 5000 Chassis Monitor
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
winsouce.jpg)