New SMT Equipment: mlcc placement force (Page 1 of 3)

JUKI JM-20 Hybrid Placement Machine

JUKI JM-20 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603~50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603~50mm, Place Speed:15,500 CPH  

Qersa Technology Co.,ltd

Hanwha SM485P Pick and Place Machine

Hanwha SM485P Pick and Place Machine

New Equipment | Pick & Place

Hanwha SM485P Pick and Place Machine Placement speed: 12,000 CPH (Optimum) Machine dimension: 1650*1679*1993mm Weight: Approx 1600kg SM485P is a multifunctional Hybrid Pick and Place Machine. In addition to SMD components, it can quickly and reliabl

Qersa Technology Co.,ltd

Surface-Mount Capacitors

Surface-Mount Capacitors

New Equipment | Components

For everything from high volume, low cost capacitors to application specific ceramic solutions, Johanson Dielectrics has you covered. The mission of the Johanson Companies is to translate our customer needs into quality electronic components, produ

Johanson Dielectrics, Inc.

High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

AT-606 Rework Station

New Equipment |  

For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s

Advanced Techniques US Inc.

AT-707 Rework Station

New Equipment |  

mBGA, BGA and QFP Placement and Rework: 1. Beam Splitter for superimposing component and board images 2. 7X to 40X magnification 3. Optional image splitter for four side viewing at high magnification 4. Placement and reflow in one position

Advanced Techniques US Inc.

Siemens Siplace  D series

Siemens Siplace D series

New Equipment |  

SIPLACE D3 � Multi Functional Placement Machine The SIPLACE D3 with its three gantries can place up to 30,100 components per hour and can be equipped with a SIPLACE TwinHead. That makes the SIPLACE D3 a fast and flexible all-rounder that can even pl

Extreme Systems Technology Phils., Inc.

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

Pick and place machines

Pick and place machines

New Equipment |  

Mechatronic systems�s P20/P40 are flexible solutions for small and medium value series in the SMT-production. These machines were developed for assignments with claim for quick change of products, operating simplicity and reliability. Thanks to the

Mechatronic Systems GmbH

reflow oven

reflow oven

New Equipment | Reflow

1, All the main parts of the equipment are imported parts, long service life. 2, using the upper and lower two temperature control area, using PID automatic fuzzy temperature control system, high precision temperature control, high stability, tempera

Shenzhen Maxsharer Technology Co., Ltd

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