New SMT Equipment: osp solderability (Page 3 of 7)

General Industrial Equipment PCB Prototype/ China HASL PCB Manufacturer

General Industrial Equipment PCB Prototype/ China HASL PCB Manufacturer

New Equipment | Prototyping

Supplier: Shenzhen Grande Electronic Layers: 4 Application: General Industrial Equipment PCB Prototype/ China HASL PCB Manufacturer PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: HASL Testing: 100% E-test Package: Vacuum packing Lead

Shenzhen Grande Electronics Co., Ltd

Stone Crusher PCB Prototype and Manufacturing Process | Grande PCB & PCBA

Stone Crusher PCB Prototype and Manufacturing Process | Grande PCB & PCBA

New Equipment | Prototyping

Supplier: Shenzhen Grande Electronics Layers: 4 Application: Stone Crusher PCB Prototype and Manufacturing Process | Grande PCB & PCBA PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing L

Shenzhen Grande Electronics Co., Ltd

Grande - Automobile PCB Prototyping and Manufacturing

Grande - Automobile PCB Prototyping and Manufacturing

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Supplier: Shenzhen Grande Electronics Layers: 4 Application: Grande - Automobile PCB Prototyping and Manufacturing   PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 da

Shenzhen Grande Electronics Co., Ltd

Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China

Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China

New Equipment | Prototyping

Supplier: Shenzhen Grande Electronic Layers: 4 Application: Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China PCB Parameter: FR-4/HTG150 Thickness:1.6mm Surface Treatment: Immersion Gold Testing: 100% E-test Package: Vacuum packi

Shenzhen Grande Electronics Co., Ltd

Pager Electronic Manufacturing | Fusion PCB Fabrication & Prototype

Pager Electronic Manufacturing | Fusion PCB Fabrication & Prototype

New Equipment | Board Handling - Storage

Supplier: Grande Electronics Layers: 4 Application: Pager Electronic Manufacturing | Fusion PCB Fabrication & Prototype PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15

Shenzhen Grande Electronics Co., Ltd

Asset Tracking Device and System Turnkey PCB Solution - Printed Circuit Board Manufacturer

Asset Tracking Device and System Turnkey PCB Solution - Printed Circuit Board Manufacturer

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Supplier: Grande  Layers: 4 Application: Asset Tracking Device and System Turnkey PCB Solution - Printed Circuit Board Manufacturer PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: HASL Testing: 100% E-test Package: Vacuum packing Lead

Shenzhen Grande Electronics Co., Ltd

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

rigid PCB

New Equipment | Other

Layers: 1-20L Material Types: FR-4, High TG, Halogen Free Max.Panel Dimension: 530mm*622mm Outline Tolerance: ±0.10mm Board Thickness: 0.40mm-3.20mm Board thickness Tolerance(t=0.8mm):±10% Width: 0.10mm Spacing: 0.10mm External: 35um-140um Int

Accuracy Electronics Technologies Co., Ltd

Low Cost Double-Side PCB Prototype huanyupcb.com

Low Cost Double-Side PCB Prototype huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm         outer layer: 0.2-3.2mm Copper ThicknessH/

PCB Manufacturer HuanYu Technologies Co., Ltd.

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.


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