New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Up to 3500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $19,975.00
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
New Equipment | Solder Materials
Sometimes you have to attempt small soldering projects on small circuits that can be hard to see and you need items like a magnification lamp or a soldering microscope. StellarTechnical.com understands this and provides a fabulous array of lighting a
Analog and digital "PACE", "QUICK" and "GOOT" soldering stations and soldering irons. http://www.selen.hr/pokaz_kategorie.php?cid=43
1)Digital Readout Model:ES-8,ES-10,ES-12 2 and 3 axis Digital Readout for lathe machine,milling machine,boring machine,EDM,wirecut,tool presetter and profile projector. 2)Linear Scale Model: GS Series Linear scale with different measurement length(f
New Equipment | Tape and Reel Services
We specialize in 3M advanced technology carrier tapes for small packages such as WLCSP, discrete semiconductor, commercial and military passives and thin film timing devices. We have the industry's broadest selection of 3M carrier tape in stock and
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Benchtop model with the finest assembly precision for low to medium volume assembly production. LE40 benchtop model of pick and place machines offers technologically advanced, low cost solutions for low to medium volume SMT placement applications.
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
