Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
If you are working with "legacy" data in a Gerber format, DownStream can "Reverse Engineer" it for you. Reverse engineering is the process of starting with Gerber files then adding part and netlist information, to create an intelligent database, whic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Tape and Reel Services
We are proud to offer a full range of surface mount taping capabilities, and not just for the everyday components. We process components as small as 0201 chips as well as giant connectors, metal stampings, PLCC 100's, MLP's, Large QFP's, MicroBGA's w
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
These evaluation boards should be used to facilitate analysis of Z-Communications' PLLs (part numbers beginning with PCA, PSN, or PSA). The MINIEVAL/SMVEVAL/USSPEVAL boards all feature the same SMA connectorized input/output ports as shown in Figure
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
X-KAR� Brand provides Rework/Repair and SMT Assembly Equipment for assembly and repair of PCB's with Surface Mount Technology Components. Rework equipment handles all standard parts plus fine pitch QFP, BGA, CSP. SMT Rework Packages include: Hot Ai
