New SMT Equipment: reflow soldering process (Page 14 of 50)

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Spray in Air Systems

New Equipment |  

Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards

Petroferm Inc

SRF 30/70 Series Reflow Soldering System

SRF 30/70 Series Reflow Soldering System

New Equipment | Reflow

SRF30 - Nitrogen Reflow Oven SRF70 - Air Reflow Oven Heating and cooling function applicable for the lead-free soldering of various boards By increasing the number of heating zones and adopting reflow soldering system, the temperature prof

Hanwha Techwin CO., LTD.

Solder pallet material

New Equipment | Solder Materials

High temperature composite material for wave solder pallet and reflow soldering pallet

New Power Technology group (HK) Ltd

GF-C2-HT Reflow Ovens

GF-C2-HT Reflow Ovens

New Equipment | Reflow

This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste

DDM Novastar Inc

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

M.O.L.E.® Reflow Oven Thermal Profilers

M.O.L.E.® Reflow Oven Thermal Profilers

New Equipment | Reflow

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

Lead-Free Hot Air Reflow Ovens

Lead-Free Hot Air Reflow Ovens

New Equipment | Reflow

Easy-operation! Save energy! Good Price ! Environment friendly! Windows XP operation software with Chinese and English alternative. Whole system under integration control can analyze and display the failure. All production data can be saved comp

ShenZhen Leadsmt Technology Co.,Ltd


reflow soldering process searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Blackfox IPC Training & Certification

High Throughput Reflow Oven
Selective soldering solutions with Jade soldering machine

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Fully Automatic BGA Rework Station

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