New SMT Equipment: shiny joint (Page 1 of 1)

Balver Zinn Alloys

Balver Zinn Alloys

New Equipment | Solder Materials

Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price

Balver Zinn

J8 No Clean Jetting Solder Paste

J8 No Clean Jetting Solder Paste

New Equipment | Solder Materials

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j

AIM Solder

SN100C-XF3+ Lead-free Solder Paste

SN100C-XF3+ Lead-free Solder Paste

New Equipment | Solder Materials

Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the

Cobar Solder Products Inc.

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

Cobar® Solder Pastes

Cobar® Solder Pastes

New Equipment | Solder Materials

Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints

Balver Zinn

LOCTITE GC 10 — The Solder Paste Game Changer

LOCTITE GC 10 — The Solder Paste Game Changer

New Equipment | Solder Materials

LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its

3 V Electronics Ltd.

Henkel Loctite GC 10 - The Game Changer

Henkel Loctite GC 10 - The Game Changer

New Equipment | Solder Materials

16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny

Blue Thunder Technologies, Inc.

M8 No Clean, Halogen-Free Solder Paste

M8 No Clean, Halogen-Free Solder Paste

New Equipment | Solder Materials

AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success

AIM Solder

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

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High Throughput Reflow Oven

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Voidless Reflow Soldering

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